| Parameter | Facultas |
| Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
| Minimum Component Size | 0201 |
| Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
| Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
| Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
| Miles crustulum Type | Plumbum vel plumbum, Free |
| Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
| Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
| Testis Methodi in-Domus | Expertus functiones, Probe Test, Senex Test, Maximum et Humile Temperature & Umor Test |
| Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |



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