Unixplor Electronics commissum est evolutioni et fabricationi qualis estAir Conditioner PCBA in forma OEM and ODM type since MMXI.
Ad primum-transitum rate of SMT solidationis Air Conditioner PCBA emendare, i.e., ad meliorem solidandi qualitatem et cedere, haec considera:
Optimise Processus Parametri:Parametros processus congruentes pro instrumento SMT pone, incluso temperatura, velocitate et pressione, ut processus stabilis et certa solidatoria caveat defectus solidandi causa caloris vel velocitatis.
Reprehendo Equipment Status:Regulariter inspicere et conservare SMT apparatum ut operationem normalem et stabilem conservet. Reponere canus components cito curare normalis apparatu operatio.
Optimize Component Placement:Cum SMT processum conventum designans, partes rationaliter collocare, considerans spatium et orientationem inter partes ad impedimentum et errores minuendos durante processu Aeris Conditioner PCBA solidandi.
Optimise Processus Parametri:Accurate componens collocationem et positionem adhibe, utens opportuna copia crustulorum solidorum et instrumentorum SMT accuratarum solidandi.
Aliquam augendae Training:Professionem professionalem operariis praebere ut eorum artes SMT solidandi et operationales artes emendare, errores operationales reducere et problemata qualitatem solidare.
Qualitas stricte Imperium:Strictam qualitatem moderandi signa et processus introducere, monitorem comprehendens et qualitatem solidariam inspicere, ac statim cognoscere, aptare, et emendare difficultates.
Continua Emendatio:Regulariter resolvere qualitates quaestiones et causas defectuum in processu glutino, amplificationes continuas deducendi, processuum optimize et procedendi, et augendi solidandi cede et producti qualitatem.
Praemissa mensura comprehendendo et exsequendo, fructus SMT vendendi pro Air Conditioner PCBA efficaciter emendari potest, ut firmitatem ac fidem solidandi qualitatis et producti qualitatis obtineat.
| Parameter | Facultas |
| Stratis | 1-40 layers |
| Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
| Minimum Component Size | 0201(0105 Metric) |
| Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
| Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
| Minimum Vestigium Clearance | 0.10 mm (4 mil) |
| Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
| Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
| Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
| Materia tabula | Koje su glavne prednosti hladnjaka sa zračnim hlađenjem? |
| Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
| Miles crustulum Type | Plumbum vel plumbum, Free |
| Crassitudo aeris | 0.5OZ – 5 OZ |
| Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
| Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
| Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
| Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Lorem solderpaste excudendi
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT pick and place done
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
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