Unixplor Electronics commissum est evolutioni et fabricationi qualis estPaper Shredder PCBA in forma OEM and ODM type since MMXI.
Cum membra electronica pro charta Shredder PCBA eligendo, sequentia puncta consideranda sunt:
Munus Requisita:Primum, constitue functiones chartas shredder PCBA necessarias ad faciendam, incluso initio, desine, regredi, ac tutelam onerare. Deinde, opportunas partes elige secundum has functiones requisita.
Requisita euismod:Ex consilio specificationum perficiendi, ut operativae intentionis, currentis, frequentiae et accurationis, selectae partes quae requisitis occurrunt ad operationem stabilem et firmam obtinendam.
Reliability:Animadverte firmitatem et spatium partium in electione. Praebitores et notas honestis elige ut firmitatem ac vetustatem efficiant.
Sumptus-Efficacia:Dum perficiendi cursus, considera componentium sumptus et partes selectas cum magno sumptus-perficiendi ratione ad faciendum productum competitive.
Sarcina Type:Lego aptam sarcinam type fundatam in extensione PCB et limitationibus magnitudinis, ut partes recte in PCB ascendantur et bonum calorem dissipationis servent.
Supple De stabilitate:Lego partes cum copia stabili, ut diuturnum tempus praebeat subsidium ac moras productionis vitandas, componentibus egestatibus vel sistendis productionibus causatis.
Compatibilitas:Partes electae curare compatiuntur cum aliis componentibus et tabulis moderandis ad vitandas instabilitatem vel conflictus per quaestiones convenientiae.
Omnia supradicta in ratione habita, singula membra diligenter eligunt ad curandum, apte congruentes cum consilio exigentiis congruentes, ac demum stabilitatem ac firmitatem chartae PCBA shredder spondent.
| Parameter | Facultas |
| Stratis | 1-40 layers |
| Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
| Minimum Component Size | 0201(0105 Metric) |
| Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
| Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
| Minimum Vestigium Clearance | 0.10 mm (4 mil) |
| Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
| Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
| Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
| Materia tabula | Koje su glavne prednosti hladnjaka sa zračnim hlađenjem? |
| Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
| Miles crustulum Type | Plumbum vel plumbum, Free |
| Crassitudo aeris | 0.5OZ – 5 OZ |
| Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
| Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
| Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
| Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Lorem solderpaste excudendi
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT pick and place done
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
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