Unixplore Electronics speciale in uni-statione turnkey fabricare et supplere pro Data Acquisitione Card PCBA in Sinis ab MMVIII cum certificatione ISO9001:2015 et PCB contionis vexillum IPC-610E, quod late in variis instrumentis industrialibus et automationis systematibus adhibetur.
Unixplor Electronics est superbire te offerreData Acquisitionem Card PCBA. Propositum est curare ut clientes nostri fructus et functiones et lineamenta plene conscii sint. Clientes novos et veteres sincero animo invitamus ut nobiscum cooperentur et ad prosperum futurum simul moveamur.
Data Acquisitionem Card PCBA (DAQ PCBA) computatrale periphericum insertum in tabula circuli impressis (PCB) dispositum est ut signa analogorum capiat ex variis sensoriis et instrumentis et eas in forma digitali convertat quas computatorium procedere potest.
Munera principalis notitia acquisitionis card PCBA includit:
Excipio signum:Capere analoga signa ex variis machinis in rebus naturalibus.
Signum conversionis:Convertere signa analogon in signa digitales per internam analog-ad-digitalem convertentis (ADC).
Data transmissio:Signum digitalis conversus ad computatorium transmittitur per ambitum interfaciendi ad ulteriores analysin et processus.
Data comparatio card PCB Coetus plerumque includit componentes keys ut circuitus analogorum ante-finium, convertentium analogorum digitalium, circuitus horologii, et circuitus interfacies, qui simul operantur ad accuratam collectionem et conversionem notitiarum.
Praeter, indicibus perficiendis notitiarum acquisitiorum card PCBA includere potest sampling rate, accuratio, numerus canalium initus, initus range, signum-ad-sonitum ratio, etc. Hi parametri directe afficiunt notitiae adquisitionis et conversionis effectum.
In genere, notitia acquisitionis card PCBA magnum munus agit in potestate industriae, automationis systematis, experimentis scientificis et in aliis campis, et est unum e elementorum praecipuorum collectionis et processus notitiarum.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options