Unixplore Electronics speciale in una-statur turnkey fabricare et supplere pro Industrial Computer PCBA in Sinis ab MMVIII cum certificatione ISO9001:2015 et PCB vexillum IPC-610E contionis, quod late in variis instrumentis et automationum instrumentorum industrialibus adhibitis.
Unixplor Electronics est superbire te offerreIndustriae Computer PCBA. Propositum est curare ut clientes nostri fructus et functiones et lineamenta plene conscii sint. Clientes novos et veteres sincero animo invitamus ut nobiscum cooperentur et ad prosperum futurum simul moveamur.
Industrialis Computer PCBA refertur ad Circuitus Typis Board Coetus processum computatrorum ditionis industrialis (etiam computatores industriales appellati). Speciatim omnes gradus electronicarum solidandi (ut chippis, resistores, capacitores, etc.) comprehendit ad tabulam ambitum impressam (PCB). Hic processus necessaria est pars fabricandae computatrorum ditionis industrialis. Rectitudinem et qualitatem circuitionis in tuto collocans, inde stabilis operandi computatrum industrialis operans.
In processu PCBA industrialis, processus fabricandi utSuperficies Montis Technologiae(SMT) etWaveTechnology venditionisSolent implicari curandi ut partes electronicae accurate solidari possint ad tabulam ambitum. Accedit, postquam totus conventus est perfectus, quisque PCB plene probatus est ut recte fungatur.
In genere, PCBA industrialis nexus magni momenti est in processu computatrorum industrialium fabricandorum. Involvit fabricationem tabularum ambitum, glutino et probationis componentium, etc., et magni momenti est ad praestationem et stabilitatem computatorum industrialium.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options