Unixplore Electronics est societas Sinensis quae in creando et producendo Smart auriculam thermometricam PCBA primitivam proferens, cum 2008. Habemus certificationes ad ISO9001:2015 et signa IPC-610E PCB conventus.
Unixplor Electronics evolutioni et productioni dicatum est qualis estDolor auris Thermometer PCBA in forma OEM et ODM productio generis cum MMXI.
Auris dolor dolor thermometrum PCBA est fabrica quae corporis temperamentum per canalem aurem mensurat. Lectiones temperatae celeris et accuratae praeparare disponitur, illudque instrumentum ideale infantibus et infantibus praebet, qui alias methodos bene tolerare non possunt. PCBA (Coetus tabulae Circuitalis impressus) cor est machinae, responsalis ut signa sensoris temperatura in notitias readabiles convertat.
Quomodo aDolor auris Thermometer PCBAopus?
Auris dolor thermometrum PCBA operatur utendo sensorem ultrarubrum ad temperamentum intra canalem auris metiendam. Sensorem vim ultrarubrum a corpore emissam capit, quae deinde in lectionem temperatam PCBA convertitur. Meditationes algorithmos provectos adhibet ad lectiones temperatas accurate curandas, necessitatem calibrationis manualem tollendo.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options