Unixplore Electronics speciale in una-statur fabricare turnkey et supplere intelligenti motoris moderatoris PCBA in Sinis ab anno 2008 cum certificatione ISO9001:2015 et PCB contionis vexillum IPC-610E.
Intellegentem motorem moderatorem PCBA(Typis Circuit Tabula Conventus)refertur ad tabulam conventus typis circuli, quae est processus solidandi electronicarum partium ad tabulam circuli impressam. Conventus completus PCBA appellatur. Praesertim callidi motoris moderatoris PCBA refertur ad tabulas impressas conventus adhibitos in motrices moderatoris callidi, quae multas technologias incisuras technologias integrat, inclusa potestate motoria, pugna increpans et tutelam, sensores, multi-tactus et usorum interfaces provectos.
Ut nucleus pars motoris intelligentis moderatoris, intelligentis motoris moderator PCBA moderatur varias motorum rationes, ut BLDC (Brushless Direct Current) motores, stepper motores, etc., per algorithmos exquisitos ad operationem motorum intelligentium et efficientem consequendam. Eodem tempore, etiam potestatem habet tutelam et pugnae sanitatis, usus flexibilium varii sensoriis, matricis dot ducatur, tubus digitalis, LCD color liquidus crystallus plenus-propono, tactus imperium et alia munera.
Motor intelligens moderatoris PCBA amplis applicationes habet, praesertim ad idoneossanitatis adjumenta, culina adjumenta, instrumenta potentia, instrumenta hortuset aliis campis. Eius consilium et facultates fabricandae societatis vires technicas et porttitor animum reflectunt, et ad mos aptari potest, ut clientes cum partibus clavis et solutionibus altiore praebeant.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options