Unixplor Electronics commissum est evolutioni et fabricationi qualis est3D typographus PCBA in forma OEM and ODM type since MMXI.
Ut diuturnum tempus stabilis operationis alicuius Ad curare longum tempus stabilis operationis 3D typographi PCBA, plures rationes appellari possunt:
Select High-Quality Components:Utere qualitate electronicarum notabilium. Hoc firmum efficit effectum, caliditas resistentia, fortis anti-impedimenta facultatum, et altiore constantia.
Design Circuits Proprie:Circuitus consilio sollicita. Potentia, humus, et lineae insignes debent logice poni ad impedimentum reducendum et strepitum electromagneticum, signo transmissioni normali procurando. Supercurrent, overvoltage, et breves-circuitus tutelae circuitus comprehendi debent.
Ensure efficax caloris dissipatio:Criticae partes excellentes caloris dissipationis consilium requirunt. Hoc fieri potest utendo calore deprimi, fans, vel ffoyle aeris in area PCB augendo ne overheat et laedat.
Utere High-Quality PCB Vestibulum Processu:Utere certis PCB materiis, solida solidanda curare, et bona mechanica viribus conservare. Vitare difficultates ex frigore solidaribus articulis vel mechanica accentus.
Stabilis Firmware curare:Progressio moderatio robusta esse debet ad ruinas et anomalias prohibendas. Specimen, debet anomalia tueri tutelam et receptam latae sententiae pro stabilitate systematis.
Impact praeventionis mensurae;Filtra utere, consilia solitaria, et potentia moderata commeatus electromagnetico externo impedire et operationem systematis lenis curare.
Actio probatio et verificationis. Praesent tincidunt velit volutpat, cursus volutpat tortor, eget volutpat quam. Cognoscere et compellare quaestiones quaelibet prompte ad diuturnum firmitatem invigilandum.
| Parameter | Facultas |
| Stratis | 1-40 layers |
| Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
| Minimum Component Size | 0201(0105 Metric) |
| Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
| Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
| Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
| Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
| Minimum Vestigium Clearance | 0.10 mm (4 mil) |
| Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
| Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
| Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
| Materia tabula | Koje su glavne prednosti hladnjaka sa zračnim hlađenjem? |
| Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
| Miles crustulum Type | Plumbum vel plumbum, Free |
| Crassitudo aeris | 0.5OZ – 5 OZ |
| Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
| Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
| Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
| Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
| PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Lorem solderpaste excudendi
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT pick and place done
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
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