Cum 2008, Unixplore Electronics unum-subsisto turnkey fabricare et subministrare operas praecipui Audio Converter PCBA in Sinis comparavit. Societas cum ISO9001:2015 certificata est et cum norma PCB conventus IPC-610E adhaeret.
Unixplor Electronics est Audio Converter PCBA artifices et praebitores in Sinis. Praebere possumus munus professionalem et melius pretium tibi. Si interesse in Audio Converter PCBA producta, pete nobis. Principia certae qualitatis, rationabilis pretii, et alacris obsequii sequimur.
Audio converter PCBA refertur ad aTypis Circuit Tabula Conventusquae conversionem audio functiones integrat. PCBA nucleus componentis variarum electronicarum productorum est. Auctor est variis electronicis machinis in unum coniungendis ut producta electronic apte operari possint. In auditione convertentis, PCBA continere potest key components ut audio processus chippis, initus et output interfaces, et administratio virtutis ad consequendum signum conversionis audio et functiones dispensando.
Speciatim principales functiones PCBA convertentis audientis includere possunt:
Audi signum conversionis;Convertere signum initus audio ad output formato requisito, sicut conversio inter signa analoga et signa digitales, seu conversionem inter varias rates sampling et frenum rates.
Audio amplificationem et ipsum:Per constructum-in soni processus auditionis, signum auditionis augetur, percolantur, et strepitus reducuntur ad meliorem soni qualitatem et experientiam audiendam.
Interface subsidium:Varias interfaces initus et output praebet, ut USB, Bluetooth, 3.5mm sinciput, etc., signa audio connectere et transmittere cum diversis machinis audio.
Potestas administratio:Curare ut audio convertentis operans stabili intentione operari et industriam salvandi et excalefactionis habere etiam lineamenta tutelae.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options