Unixplore Electronics specialitas in una-statur fabricare turnkey et supplere qualitatem altae BEC PCBA in Sinis ab anno 2008 cum qualitate certificationis ISO9001:2015 et PCB contionis vexillum IPC-610E.
Ut opificem professionalem, UNIXPLORE Electronics te praebere velim qualitatem altamBEC PCBAuna cum decimis venditionibus et opportuna traditione.
BEC(Circuit Eliminator altilium)PCBA est ad fontem stabilem et continuam virtutis tuae fabricam praebere. BEC PCBA necessitatem gravidarum tollit, solutionem sumptui-eficiens et environmentally- amicabiliter praebens. BEC PCBA facile in consilio tuo existente inspici potest, ut perfectam solutionem variis applicationibus conficias.
Solet Pugna Eliminator Circuit PCBA instructa est systematis tutelae nimis intentione, curans ut machinam tuam ab omnibus subito motibus in intentione defendatur. BEC PCBA etiam in systematis tutelae thermarum aedificatum notat, quod monitores in circuitu temperaturas ac potestatem copiam proinde accommodet.
Haec PCBA versatilis est et in amplis machinis laborare potest, inclusa non limitata ad lumina, electronica nugas, et in autocineto remoto. Cum BEC PCBA, certo scias potes machinam tuam nunquam e potentia excurrere!
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options