Unixplore Electronics est societas Sinensium quae in creandis et producendis Instrumentis PCBA primigenii generis pulchritudinis est ab 2008. Testificationes habemus ISO9001:2015 et signa IPC-610E PCB conventus.
Cum eius anno 2011 institutio, Unixplore Electronics consilio et fabrica GENERALIS commissum estforma instrumenti PCBAsin forma OEM et ODM productionis genus.
A Pulchritudo Instrumentum PCBAest a *Typis circuli tabulas conventuselectronic cogitationes in pulchritudo. Hae technologiae electricae et/vel electronicae technologiae utuntur ad curationes cuti et capillorum incitandas, trucido aut applicandas. A professio pulchritudinis instrumentum PCBA typice includit plura membra, ut microcontrollers, administratio circuitus, sensoriis et instrumentorum usorum, inter alia.
Quidam instrumenti vulgaris pulchritudo PCBAs includitultrasonic vultus cogitationes, DUXERIT Lorem machinarum lux, radiofrequency cutis tensis cogitationes, capillus incrementum galeaeatque etiamdolor speculorum. Hae PCBAs ordinantur ad peculiarem speciem curationis pulchritudinis usoris praebere in modo non-incursio vel minime-incursio.
Pulchritudo instrumenti PCBAs late in industria pulchritudinis adhibentur et ex instrumentis electronicis praebitoribus vel fabricatoribus mercari possunt, qui specializent in conventibus PCB ad pulchritudinis machinas producendas. Gravis est animadvertere has rationes PCBAs excogitare et fabricare scientiam progressam in electronicis machinalis postulare, ergo si vis consuetudinem Beauty Instrumenti PCBA creare, commendatur ad auxilium professionalem vel regimen quaerendum.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options