Unixplore Electronics est societas Sinica quae in creando et producendo primigenii genus glucosi sanguinis metri PCBA acri cum 2008. Testificationes habemus ad ISO9001:2015 et signa conventus IPC-610E PCB.
Unixplore Electronics dedicatum est High qualityDolor sanguinis glucose metri PCBA consilio et fabricare quia in MMXI aedificavimus.
Smert Sanguinem Glucosum PCBA facere, scientia electronicarum designandi opust, tabulae ambitus layout, ac programmandi microcontroller. Hic est processus generalis GRADATUS qui tibi auxilium incipias:
Colligite inquisita compositiones et instrumenta consiliorum:Glucosum sensorem, Microcontroller, Power Supple, LCD propono, et alia elementa necessaria. Etiam eget luctus sem.
Designabis ambitum schismatici;Utere programmate PCB consilio ut schema rotundum schismaticum efficiat. Hoc erit blueprint pro PCB layout.
PCB layout:Postquam schematicum schematicum creavisti, eodem consilio PCB utere utendo ut componentes in tabula PCB pono.
PCB fabricare:Tuam PCB tabellam designat ad PCB fabrica ut fictam mitte.
Componere partes;Recepta nudum PCB, solida componi diligenter.
Programma microcontroller:Microcontroller ad computatrum et programmata coniunge eam cum tabella hex ut datam sensorem glucosum legas et eam in screen LCD ostendas.
Probate PCB:Postquam peracta est, proba PCB ut recte laborat.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Turnaround Tempus | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options