Unixplore Electronics est societas Sinica, quae in creando et producendo primo-classis incurrens Pilam PCBA pro Vehiculo Electrico ab 2008. Habemus certificationes ad ISO9001:2015 et signa IPC-610E PCB conventus.
Qualitas altusPrcipientes struem PCBA ad Electric Vehiculum moderatoris fabrica Sinensium Uniexplore Electronics providetur. Summus qualitas autocineti premens acervum PCBA directe ad low prices.
PCBA incurrentes acervus (Typis Circuit Tabula Conventus) refertur ad electronicam ambitum quae est pars acervi vel emissarii stationem pro vehiculis electricis (EVs). Rogus muniens est fabrica quae vim electricam praebet ut gravida vehiculis electrica recharge. Circuitus cardus pars crucialis est intra acervum praecipiens, responsalis moderandi et administrandi processum denuntians.
Rogus PCBA schedulae incurrens typice includit varia electronica elementa, ut microcontrollers, administratio potentiarum circuitus, modulorum communicationis, sensoriis, et alia necessaria ad debitam struem incurrentis operationem. Microcontroller partes centrales exercet in processu impetuoso, vigilantia parametris sicut intentione, currenti et temperatura, et communicando cum vehiculo vel systemate centrali.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options