Unixplore Electronics est societas Sinica, quae in creando et producendo primum genus Power Supple PCBA est pro automobile lumen ab extremo 2008. Habemus certificationes ad ISO9001:2015 et signa conventus IPC-610E PCB.
Unixplore Electronics dedicatum est High qualityPdebet Supple PCBA ad Automobile Audi lux consilio et fabricare quia in MMXI aedificavimus.
Potentia copia PCBA pro autocineto postico lumine est tabula circuitus quae responsabilis est ad lucem posteriorem vehiculi comparandam.
De more, potentia autocineti copia PCBA constat ex pluribus componentibus quae ordinator voltage, copulentiae capacitores et rectificatores includunt. The voltage moderator is responsible for controling the voltage of power delivered to the rear light. Hoc stabilitatem praestat potentiae luci posteriori praebendae, cuiuscumque fluctuationes in intentione systematis electrica vehiculi.
Facultates coitus adiuvant ad eliquandum strepitum inutilem et ad stabilitatem virtutis partus conferunt.
Rectificatores vim AC (alternantem currentem) suppleta e altilium autocineto in DC (directam currentem) potentiam convertunt quae lumen ab tergo adhiberi potest.
Cetera lineamenta comprehendi possunt in potentia copia PCBA ad tuendos partes motus a spiculis voltagenis et exundationibus.
Potestatem supplere PCBA pro lumine autocineto tergo designato typice destinatur ad resistendum duris ac postulandis ambitum applicationum automotivarum, incluso iugis calidis et continuis vibrationibus.
Progressus technicae artis et qualitatis moderatio gradus in quibus talis potentiae copiae efficiendae PCBAs efficiunt, satis certos faciunt ut potestatem automobile in lucem educendi altam efficientiam praebeant, longitudinis et diuturnitatis procurandi.
Parameter | Facultas |
Stratis | 1-40 layers |
Conventus Type | Per-Hole (THT), Superficies Mount (SMT), Mixtum (THT+SMT) |
Minimum Component Size | 0201(0105 Metric) |
Maximum Component Location | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Pars Package Genera | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, SUMMERGO, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) pro QFP, QFN, 0.8 mm (32 mil) pro BGA |
Minimum Vestigium Latitudo | 0.10 mm (4 mil) |
Minimum Vestigium Clearance | 0.10 mm (4 mil) |
Minimum EXERCITATIO Location | 0.15 mm (6 mil) |
Maximum Board Location | 18 in x 24 in (457 mm x 610 mm) |
Tabula Crassitudo | 0.0078 in (0.2 mm) ad 0.236 in (6 mm) |
Materia tabula | CEM-3, FR-2, FR-4, High-Tg, HDI, Aluminium, High Frequency, FPC, Rigid-flex, Rogers, etc. |
Superficiem Conclusio | OSP, HASL, Mico Aurum, Enig, Aurum Digitus, etc. |
Miles crustulum Type | Plumbum vel plumbum, Free |
Aeris Crassitudo | 0.5OZ – 5 OZ |
Processus Conventus | Reflow Soldering, Undo Soldering, Manual Soldering |
Inspectionis Methodi | Automated Optical Inspectionis (AOI), X radius Visual Inspectionis |
Testis Methodi in-Domus | Expertus functiones, Proba Test, Senex Test, Maximum et Minimum Temperature Test |
Tunc turnaround | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Conventus Signa | ISO9001:2015; ROHS, UL 94V0, IPC-610E classis II |
1.Automatic solderpaste printing
2.solderpaste excudendi fieri
3.SMT robora et locum
4.SMT carpi loco fieri
5.parata reflow solidatorium
6.reflow solidatorium fieri
7.parata AOI *
8.AOI inspectionem processus
9.THT component collocatione
10.fluctus solidarii processum
11.THT conventus fieri
12.AOI metus conventus THT
13.IC programming
14.munus test
15.QC Moderare et Reficere
16.PCBA processus conformis coating
17.ESD sarcina
18.Promptus pro Shipping
Delivery Service
Payment Options